| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a device is enlarged since a wafer sheet fixing stand is made horizontal and it is disposed in an XY table for correcting the positions of individual chips although the size of a wafer becomes large for reducing a semiconductor manufacturing cost. SOLUTION: In a chip handling device, the chip is transported and bonded to a lead frame. A chip supply stand where a wafer sheet is fixed is almost vertically disposed. A chip suction head, which rotates at about 90 degrees and swing-transports the chip, transports the chip onto the lead frame in one unit.
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