发明名称 |
Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit |
摘要 |
A structural analysis program which enables easy structural analysis in accordance with a finite element method based on data representing a two-dimensional shape. A two-dimensional model of a structure is produced in response to a manipulation input which designates a material arrangement pattern and a thickness of each layer of the structure. A three-dimensional model is produced by adding the designated thickness of each layer to the material arrangement pattern of the layer so as to make the material arrangement pattern three-dimensional and stacking the three-dimensionalized material arrangement pattern of each layer. A finite element model is produced by dividing the three-dimensional model into a plurality of voxels. The computer performs structural analysis based on the produced finite element model. Thereby, an analysis result of a multilayer structure defined by the two-dimensional model is obtained.
|
申请公布号 |
US2003055612(A1) |
申请公布日期 |
2003.03.20 |
申请号 |
US20020157926 |
申请日期 |
2002.05.31 |
申请人 |
FUJITSU NAGANO SYSTEMS ENGINEERING LIMITED |
发明人 |
AMAKAI MAKOTO;SUGIURA IWAO;NEGISHI TAKANORI;KAWASHIMA YASUHIRO;KAMURAI GEN;IMAMURA KAZUYUKI |
分类号 |
G06F17/50;(IPC1-7):G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|