| 摘要 |
Electronic component, in particular a chip, which can be electrically bonded by means of a plurality of contacts provided on the component to mating contacts provided on a carrier, each contact (9) having a raised elastic base (3) of a conductive material which is connected to a lead (7) on the component side, and to which there is applied on the upper side a metallic cap-like contact covering (6), only partially covering the base (3). |
