| 摘要 |
PROBLEM TO BE SOLVED: To provide an MMIC package which enables to reduce parasitic capacitance and conductance. SOLUTION: The monolithic microwave integrated circuit (MMIC) package comprises an MMIC die, a heat sink, an insulation substrate, and a sealing material. The heat sink is disposed in an active region, and a plurality of bonding pads are disposed in the peripheral region of the heat sink. The insulator substrate is provided with an opening and a plurality of input/output ports, the opening is used to include the heat sink, and the input/output ports are electrically connected to the bonding pads. The sealing material is provided between the insulator substrate and the MMIC die and covers the MMIC die, so that the MMIC die is fixed to the insulator substrate and is protected. |
