| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer mapping system capable of forming map data with cheap and simple arrangement. SOLUTION: A scanner 2 is disposed between an inspection process 1 and an assembly process 3, and imaging data on a surface of a wafer (W) obtained by the scanner 2 is supplied to a data processor 4. The data processor 4 corrects the distortion of the supplied image data (D1), and then a grid line suggesting a boundary between chips is formed. Thus, a region for forming individual chips is specified and the presence or absence of a marking (Mk) is determined in each region for forming individual chips to form mapping data. |
