METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To appropriately and simultaneously cut unnecessary resin parts when a lead frame is cut in the manufacturing method of an electronic device where an installation part having a heat sink on which a heater element is loaded and the lead frame is sealed by resin in a state where the end part of the heat sink is exposed. SOLUTION: A mold is provided with a space 110 for sealing device, an accumulation part 120 accumulating resin 50 outside the end 21 exposed from resin 50 in the heat sink 20 and a connecting part 130 connecting the space 110 and the accumulation part 120 inside. The installation part is arranged in the mold, and resin 50 is packed and cured. The guide frame 33 of the lead frame 30 is cut and a connection resin 53 formed by the connection part 130 of the mold is cut. The mold where the width (t) of the connection part 130 in a direction orthogonal to the cutting direction of the connection resin part 53 is 0.05 mm to 0.15 mm is used.