DIE BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the setting precision of reference height in the thrust mechanism of a die bonder. SOLUTION: A plate PL is kept above the thrust mechanism 2, and the collet C of a suction mechanism 1 is lowered. The collet C is brought into contact with the surface of the plate PL and a thrust needle N is gradually raised. The thrust needle N reaches the rear face of the plate PL and the plate PL is lifted. Thus, the position of the thrust needle N when the position of the collet C starts rising or when it rises by a prescribed distance is stored in the thrust mechanism 2 (die bonder) as reference height.