| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer interconnection circuit substrate which assures the sufficient adhesive strength of an interface between a conductor layer and a thermosetting adhesive layer to be laminated to enhance connecting strength between the conductor layer, and thereby manufactures the multilayer interconnection circuit substrate having high reliability. SOLUTION: The method for manufacturing the multilayer interconnection circuit substrate comprises the steps of laminating the thermosetting adhesive layer 15 on a first conductor layer 12, then forming an opening 14 in the layer 15, filling the opening 14 with solder powder 17 at an ambient temperature, and then laminating a second conductor layer 23 on the layer 15 including the opening 14 filled with the powder 17. The method further comprises the steps of heat-melting the powder 17 thereafter, and electrically connecting the first layer 12 to the second layer 23. |
