| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board for manufacturing a multilayered wiring board that is excellent in handleability, and to provide a multilayered wiring board using the wiring board. SOLUTION: In the wiring board for manufacturing a multilayered wiring board, a conductor circuit 104 and a reinforcing frame 105 are embedded in an insulating layer 106, with one surfaces of the circuit 104 and frame 105 being exposed, and conductor posts are formed on the surface of the circuit 104 opposite to the surface exposed from the insulating layer 106 through the insulating layer 106. In addition, the surface of the insulating layer 106 opposite to the surface on which the conductor circuit 104 is exposed and the surfaces of the conductor posts are covered with adhesive layers. |
