发明名称 |
Sn PLATING FLAT CONDUCTOR AND FLAT CABLE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide Sn plating flat conductor and flat cable using the same superior in properties of bending resistance, connector connection, wear resistance and soldering. SOLUTION: Sn plating layer 2 of thickness 0.05μm or more is provided on whole surface of conductor 1 having U-shaped section of thickness 0.1 mm or less and width 1.5 mm or less. The Sn plating layer 2 is composed of pure Sn plating layer 2 and metal compound layer 4 formed between the pure Sn plating layer 3 and the conductor 1. Ratio of thickness V1 of the pure Sn plating layer 3 to thickness V2 of the metal compound layer 4 preferably satisfies an expression 1. 2<V1/V2<20 (1).
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申请公布号 |
JP2003086024(A) |
申请公布日期 |
2003.03.20 |
申请号 |
JP20010278322 |
申请日期 |
2001.09.13 |
申请人 |
HITACHI CABLE LTD |
发明人 |
ICHIKAWA TAKAO;YAMANOBE HIROSHI;AOYAMA MASAYOSHI |
分类号 |
C25D5/50;C25D7/06;H01B5/02;H01B7/08;(IPC1-7):H01B5/02 |
主分类号 |
C25D5/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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