LEAD FRAME, RESIN-SEALED SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To constitute a lead frame capable of bottom-surface mounting with a frame body integral with a die pad, and to improve reliability of a resin- sealing semiconductor device that uses the frame body. SOLUTION: The central part of a die pad 13, in which the profile of a lead frame 10 is almost square in top view, is provided with a holding region 23 formed by pushing the central part upward. Four openings 23a of bow-shape in plan view are provided to the peripheral part of the holding region 23, and the region surrounded with opening sides that are bowstrings of the openings 23a is a part to substantially secure and hold a semiconductor chip, which comes to be a central holding part 23b of the square in plan view. The corners of the central holding part 23b are connected to a die pad 13 using connection parts 23c provided between adjoining openings 23a.