| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which enables easy fabrication and enables to prevent the wetting and expansion of an adhesive, to provide an adhesive sheet-attached reinforcing board which enables to prevent wetting and expansion of an adhesive, and to provide a method of fabricating the same. SOLUTION: The method of manufacturing a wiring board 1 comprises an attachment process of attaching an adhesive sheet to a reinforcing board 12; a sheet-cutting and recess- forming process wherein the adhesive sheet attached to the reinforcing board 12 is cut into an adhesive sheet piece of a predetermined shape, and at the same time, recesses 15 and 16 which are nearly coincident with the cut lines are formed in the reinforcing board 12; and a bonding process wherein the adhesive sheet piece attached to the reinforcing board 12 is laid on top of a main body 2 of the wiring board, and is heated to bond the reinforcing board 12 and the main body 2 of the wiring board via an adhesive layer 25. The adhesive sheet piece is easy to handle and can be attached to a predetermined place of the reinforcing board 12 accurately. Even if the adhesive leaks out of the adhesive sheet piece, wetting and expansion of the adhesive can be prevented by the recess 15 or the like, resulting in preventing the leakage of the adhesive to a side face 1C of the wiring board 1 and an area near connection pads 3 whereon IC chips are mounted.
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