发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which has high performance and high reliability at a low cost by preventing the manufacturing processes from increasing. SOLUTION: On a semiconductor substrate where at least a photoelectric conversion part, a transfer electrode, and a shading film are formed, an inter- layer film having a concave part resulting from the transfer electrode and shading film is formed above the photoelectric conversion part, and a material film which has a high refractive index and photosensitivity is patterned while left above the photoelectric conversion part. The magnetic film is deformed through a heat treatment to form an in-layer lens having concave parts on both surfaces.
申请公布号 JP2003086778(A) 申请公布日期 2003.03.20
申请号 JP20010275283 申请日期 2001.09.11
申请人 SHARP CORP 发明人 AOKI TETSUO
分类号 H01L27/14;(IPC1-7):H01L27/14 主分类号 H01L27/14
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