发明名称 |
Leiterrahmen-Kondensator |
摘要 |
A capacitor (10) is provided including first and second electrodes (12,14) formed from portions of the lead frame structure (30) used in conventional integrated circuit packaging. The electrodes (12,14) are encapsulated with dielectric molding material (40) which provides dielectric insulation between the electrodes (12,14). A low power capacitively-coupled digital isolator circuit (50) is also provided. The circuit employs a pair of the lead frame capacitors (105,115) of the present invention and includes differential driver and receiver circuits (110,120). The receiver (120) can also include an optional filter (136) for increasing noise and glitch immunity. |
申请公布号 |
DE69332140(T2) |
申请公布日期 |
2003.03.20 |
申请号 |
DE1993632140T |
申请日期 |
1993.12.02 |
申请人 |
LINEAR TECHNOLOGY CORP., MILPITAS |
发明人 |
DOBKIN, ROBERT C.;REAY, ROBERT L. |
分类号 |
H01L23/50;H01L21/822;H01L23/495;H01L23/64;H01L25/00;H01L27/04;H05K1/16;H05K3/20 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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