| 摘要 |
PURPOSE: A method for eliminating a photoresist layer is provided to save fabricating cost and to prevent plasma damage to a lower layer under resist, by using conventional equipment for a mask process and developer. CONSTITUTION: The lower layer(11) is formed on a substrate(10). The resist(12) is applied on the lower layer. The resist is exposed to plasma. The resist exposed to the plasma is exposed to developer and eliminated so that the lower layer is exposed. A cleaning process is performed regarding the substrate. A transparent substrate is used as the substrate, and a chrome layer is used as the lower layer.
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