METHOD FOR BONDING AND ELECTRICALLY CONNECTING MICROSYSTEMS INTEGRATED IN SEVERAL DISTINCT SUBSTRATES

摘要

PURPOSE: A method for bonding and electrically connecting microsystems integrated in several distinct substrates is provided to obtain a suitable bonding characteristic between wafers as a semiconductor material by making micro-integrated devices in at least one of the two substrates using microelectronic processing techniques and by bonding the substrates. CONSTITUTION: Bonding regions(32) of a deformable material are formed on the first substrate(33). The substrates are pressed to one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer(30) made of a material chosen from aluminum, copper and nickel, covered with a thin layer(31) made of a material chosen from palladium and platinum. Spacing regions(25') guarantee exact spacing between the two wafers.