FLUX APPLYING METHOD, FLOW SOLDERING METHOD AND DEVICES THEREFOR AND ELECTRONIC CIRCUIT BOARD
摘要
<p>It is realized that a solder material is sufficiently supplied to a through hole formed through a board by a spraying mode flux applying method in a flow soldering process for mounting an electronic component onto the board by means of a solder material.</p><p>In the spraying mode flux applying method for applying the flux including an active ingredient and a solvent onto the board by spraying the flux toward the board from a nozzle, the flux is sprayed and adheres to the board while remaining in a state of solution. More specifically, a distance between the nozzle for spraying the flux toward the board and the board located over the nozzle is set at about 30 to 60 mm.</p>
