发明名称 |
Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
摘要 |
A connection method and a connection structure, using solder bumps, for component-side pad electrodes and substrate-side pad electrodes, and inspecting methods for the connection state thereof which are adaptable to high density mounting, and which allow the miniaturization of the product formed by mounting a surface-mount component onto a substrate. Substrate-side pad electrodes are arranged inside a component-corresponding region A; the length of the substrate-side pad electrodes is set to be larger than that of the corresponding component-side pad electrode; an IC chip (surface-mount component) is placed on the substrate so that each of the solder bumps is opposed to a predetermined substrate-side pad electrode; and the solder bumps are melted by heating, thereby connecting each of the component-side pad electrodes and one of the substrate-side pad electrodes through the solder. |
申请公布号 |
GB2372634(B) |
申请公布日期 |
2003.03.19 |
申请号 |
GB20010023370 |
申请日期 |
2001.09.28 |
申请人 |
* MURATA MANUFACTURING CO. LTD. |
发明人 |
RYOICHI * MORIMOTO;JITSUHO * HIROTA;TATSUYO * FUNAKI |
分类号 |
G01N23/04;G01N33/20;H01L21/60;H01L21/66;H01L23/498;H05K1/18;H05K3/34 |
主分类号 |
G01N23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|