| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a plating film which has improved wettability to lead-free solder. SOLUTION: In a plating bath provided with a cathode capable of varying current and an anode, a plating film is applied to an object to be plated at a first current density for a predetermined period, and, after that, the object to be plated is retained at a second current density lower than the first current density, or, the object to be plated is dipped into a trisodium phosphate solution having a concentration of 5 to 10 wt.%, so that the plating film is formed. |
