| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for image formation, excellent in sensitivity in exposure and capable of reproducing a faithful pattern after development and to particularly provide an image forming photosensitive resin composition suitable for use as a soldering resist, an etching resist or an electroless plating resist for production of a printed wiring board and suitable for an insulating layer of a build-up process printed wiring board, a black matrix, a color filter and photo-spacers for production of a liquid crystal panel and an electrode, barrier ribs, a phosphor, a printing plate, etc. SOLUTION: The image forming photosensitive resin composition comprises a curable resin having two or more radical-polymerizable unsaturated bonds in one molecule, a compound having a vinyl ether group and a (meth)acryloyl group in one molecule and a photopolymerization initiator. |
