LIQUID EPOXY RESIN COMPOSITION FOR SEALING FILLER

摘要

PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for a sealing filler imparted with a function comparable to the function attained by a flux treatment to remove the oxide film such as a bump electrode using a lead-free tin alloy solder and exhibiting desired resin properties also as an underfill (sealing filler). SOLUTION: The liquid epoxy resin composition for the sealing and filling stage in a flip chip mounting process is produced by using (A) a liquid thermosetting epoxy resin and (B) a curing agent composed of an acid anhydride as essential components and adding (C) a 9-15C dicarboxylic acid as a flux activity promoting component having proton donative property in an amount of 5×10<-2> to 5×10<-1> mol based on 1 mol of the acid anhydride.