LIGHT EMISSION MODULE AND LIGHT RECEPTION MODULE

摘要

PROBLEM TO BE SOLVED: To provide a surface mount type light emission module and a light reception module which are adaptive to solder reflowing. SOLUTION: On the surface of the housing 1 of an optical mini jack module 10 as the light emission module, a reception opening that couples a jack type connector holding an end of a single-core optical fiber 30 is formed. In the housing 1, parallel arms which clamp a light emission device 6 are formed in one body; and the parallel arms have a couple of projections and the light emission device 6 has a recess engaged with them. A connection electrode 7a electrically connected to part of the wiring pattern of a substrate 7 is compression bonder with a contact part 2a as a conduction member of a lead terminal 2 buried in the reverse surface of the housing. 1. The lead terminal 2 having nearly L-shaped section is suitable for surface mounting on a mount substrate.