| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor inspecting device and a semiconductor inspecting device, capable of easily coping with an increase in number of electrodes for inspection, facilitating manufacture, and absorbing a large difference in height between the adjacent electrodes. SOLUTION: In the manufacturing method for the semiconductor inspecting device and the inspecting device, a bump is brought into contact with the electrode formed on the surface of the semiconductor device to perform electric inspection for the semiconductor device. A through hole 26 and a wiring layer 28 for transmitting an inspection signal are formed in a base board 22 pressed to the semiconductor device, and a conductive rubber member 32 is formed in the through hole 26. The bump 34 is formed in the conductive rubber member 32 to be projected from the lower layer side of the base board 22.
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