| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of bonding easily a semiconductor pressure sensor chip, and reducing fluctuation of an offset value caused by a mechanical stress from a package. SOLUTION: This semiconductor pressure sensor has the package 2 having a pressure introduction hole 21 on the bottom face of a box shape having one open face, and the pressure sensor chip 3 having a thick wall part around a diaphragm, and is formed by bonding the thick wall part undersurface 33 onto the package 2 so as to close the pressure introduction hole 21 by the pressure sensor chip 3. A groove 22 is formed around the pressure introduction hole 21, and the groove 22 is filled with a bonding agent 4, to thereby bond and fix the pressure sensor chip 3 so as to interpose the bonding agent 4 on the thick wall part undersurface 33.
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