PURPOSE: A sputtering apparatus is provided to control efficiently an abrasion profile of a target by providing magnetic field to an entire surface of the target. CONSTITUTION: A magnetic field generation portion(40) includes a support portion(403) having a shape of plate. A center shaft of a target and a center shaft of the support portion(403) are located on the same line. The magnetic field generation portion(40) includes a main magnetic field generation portion(405). The main magnetic field generation portion(405) is arranged at one side of the support portion(403). The magnetic field generation portion(40) includes a rotary driving portion such as a motor. The rotary driving portion is installed at an opposite side to the main magnetic field generation portion(405). The magnetic field generation portion(40) includes an assistant magnetic field generation portion(407) is installed at the other side of the support portion(403).
