发明名称 |
EMBOSSING TAPE FOR ELECTRONIC PARTS, ITS MANUFACTURING METHOD AND POCKET FORMING DIE |
摘要 |
PROBLEM TO BE SOLVED: To provide an embossing tape for electronic parts capable of surely preventing a lead wire from being deformed while the electronic parts are moved within a package in a lateral direction during transportation or the like. SOLUTION: There is provided an embossing tape 1 for electronic parts having a pocket 3 for storing electronic parts and a rib 9 raised from a bottom surface 5 of the pocket 3 so as to hold the electronic parts 4 stored in the pocket. The rib 9 is inclined against the bottom surface 5 of the pocket 3 in the same direction as that of a lower side surface 12 of the package 11 of the electronic parts 4 and more gradually than the lower side surface 12 and the lower edge of the electronic parts 4 is received in the rib 9 without any clearance at all. |
申请公布号 |
JP2003081331(A) |
申请公布日期 |
2003.03.19 |
申请号 |
JP20010281224 |
申请日期 |
2001.09.17 |
申请人 |
GOLD KOGYO KK |
发明人 |
MURATA KENTARO |
分类号 |
B65D73/02;B29C59/02;B29L7/00;B65B15/04;B65D85/86;(IPC1-7):B65D73/02 |
主分类号 |
B65D73/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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