发明名称 |
FIXING METHOD FOR MULTI-LAYER FILM SUBSTRATE, MULTI-LAYER FILM SUBSTRATE, AND EXPOSURE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To remove deformation in a face shape of a multi-layer film substrate even when the face shape is deformed in fixation of a metal frame onto the multi-layer film substrate. SOLUTION: This multi-layer film substrate fixing method related to the present invention is a method for fixing the metal frame 2 onto the multi-layer film substrate 1 as an optical component. In the method, metal is deposited between the metal frame 2 and the multi-layer film substrate 1 to fix the metal frame to the multi-layer film substrate. The method for depositing the metal is an electroless plating method, and the metal is an electroless deposition film 3. |
申请公布号 |
JP2003084096(A) |
申请公布日期 |
2003.03.19 |
申请号 |
JP20010277809 |
申请日期 |
2001.09.13 |
申请人 |
NIKON CORP |
发明人 |
ISHIYAMA WAKANA |
分类号 |
G21K1/06;G02B5/08;G02B5/10;G02B5/26;G02B5/28;G02B7/00;G03F7/20;G21K5/02;H01L21/027;(IPC1-7):G21K1/06 |
主分类号 |
G21K1/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|