发明名称 FIXING METHOD FOR MULTI-LAYER FILM SUBSTRATE, MULTI-LAYER FILM SUBSTRATE, AND EXPOSURE DEVICE
摘要 PROBLEM TO BE SOLVED: To remove deformation in a face shape of a multi-layer film substrate even when the face shape is deformed in fixation of a metal frame onto the multi-layer film substrate. SOLUTION: This multi-layer film substrate fixing method related to the present invention is a method for fixing the metal frame 2 onto the multi-layer film substrate 1 as an optical component. In the method, metal is deposited between the metal frame 2 and the multi-layer film substrate 1 to fix the metal frame to the multi-layer film substrate. The method for depositing the metal is an electroless plating method, and the metal is an electroless deposition film 3.
申请公布号 JP2003084096(A) 申请公布日期 2003.03.19
申请号 JP20010277809 申请日期 2001.09.13
申请人 NIKON CORP 发明人 ISHIYAMA WAKANA
分类号 G21K1/06;G02B5/08;G02B5/10;G02B5/26;G02B5/28;G02B7/00;G03F7/20;G21K5/02;H01L21/027;(IPC1-7):G21K1/06 主分类号 G21K1/06
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