| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of performing the reliability test of a joint part of an electronic part with a short testing time and a small number of samples. SOLUTION: This method for testing the reliability in the joint part of the electronic part with a substrate comprises a process 1 for measuring the initial resistance values RA0 and RB0 of the respective joint parts of a device A to be tested and a benchmark device B with a known reliability characteristic value; a process 2 for executing temperature cycle life tests of the number of cycles allowing the observation of the change of the initial resistance values RA0 and RB0 ; a process 3 for measuring the respective resistance values RA and RB of the devices A and B after the execution of the life test; a process 4 for calculating the logarithmβA of the ratio of initial resistance value RA0 to resistance value RA and the logarithmβB of the ratio of initial resistance value RB0 to resistance value RB; and a process 5 for calculating the reliability characteristic value TA of the device A from the calculated values ofβA andβB and the known reliability characteristic value TB of the device according to TA=(βA/βB).TB.
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