| 摘要 |
PROBLEM TO BE SOLVED: To provide an acrylic resin for an adhesive or for an adhesive film which has resistance to heat, electrolytic corrosion and moisture necessary in mounting semiconductor chips having significant difference in coefficient of thermal expansion from a printed wiring board such as a glass epoxy board or flexible board, and in particular is slight in deterioration when put to moisture resistance test under severe conditions including PCT (pressure cooker test) treatment. SOLUTION: This acrylic resin with a weight-average molecular weight of 500,000-1,500,000 and a glass transition temperature of -30 to 10 deg.C is obtained by polymerization of a polymerizable monomer mixture comprising (A) an epoxy group-bearing (meth)acrylate monomer, (B) acrylonitrile and (C) imido(meth)acrylate.
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