| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating catalyst which can be suitably used for applying an electroless plating catalyst to only a conductor part of a material to be plated consisting of the conductor part and an insulator part, which hardly causes nondeposition of plating on the conductor part and spreading of plating to the insulator part, in which adsorption of catalytic metal to a catalyzing tank can be minimized and which exhibits excellent stability. SOLUTION: The catalyst solution for electroless plating is composed of an aqueous solution containing (i) at least one compound selected from the group consisting of gold compounds, silver compounds, palladium compounds, ruthenium compounds, rhodium compounds, platinum compounds and copper compounds and (ii) a water-soluble nitrogen compound containing hexavalent sulfur.
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