| 发明名称 |
NON-PERFLUORO FLUORORESIN MOLDED ARTICLE HAVING LOW-TEMPERATURE HEAT SEALABILITY |
| 摘要 |
<p>An excellent low temperature heat sealing property is imparted to a surface of a non-perfluoro fluorine-containing resin molded article having F/C of not more than 1.8. A non-perfluoro fluorine-containing resin molded article having a surface layer portion having a low temperature heat sealing property on at least a part of the surface layer thereof; said surface layer portion having a low temperature heat-sealing property has a ratio F/C of the number of fluorine atoms to the number of carbon atoms of 0.2</=F/C</=0.9 and a ratio O/C of the number of oxygen atoms to the number of carbon atoms of 0.09</=O/C</=0.40, and a remaining portion of the surface layer has a ratio F/C of the number of fluorine atoms to the number of carbon atoms which is larger than that of the surface layer portion having a low temperature heat-sealing property and is 0.8</=F/C</=1.8. <IMAGE></p> |
| 申请公布号 |
EP1160270(A4) |
申请公布日期 |
2003.03.19 |
| 申请号 |
EP19990970098 |
申请日期 |
1999.10.01 |
| 申请人 |
DAIKIN INDUSTRIES, LIMITED |
发明人 |
ICHIBA, SHIGERU;NAKATA, YUTAKA;SHIMADA, KAZUHIKO |
| 分类号 |
B32B27/08;C08J7/12;H01M2/02;(IPC1-7):C08J5/00;H01L31/048;B32B7/10;C08J7/18 |
主分类号 |
B32B27/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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