ELECTROSTATIC CHUCK OF SEMICONDUCTOR FABRICATION EQUIPMENT

摘要

PURPOSE: An electrostatic chuck of semiconductor fabrication equipment is provided to exchange only a chucking plate in an exchanging process of the electrostatic chuck by improving a structure of the electrostatic chuck. CONSTITUTION: The RF power is applied to a bottom electrode(100). An electrostatic chuck body(120) is fixed to the bottom electrode(100). A positive pole electrode bar(122) and a negative pole electrode bar(124) are formed at the electrostatic chuck body(120). A chucking plate(160) has a structure which is coupled with the electrostatic chuck body(120) or decoupled from the electrostatic chuck body(120). An electrostatic chuck is formed with the electrostatic chuck body(120) and a chucking plate(140). The chucking plate(140) is connected with the electrostatic chuck body(120). A coolant flow line is formed at the electrostatic chuck body(120).