| 摘要 |
PURPOSE: A stack package is provided to process easily a /CS(Chip Select) pin in a top package and restrain the damage of a semiconductor chip due to a reflow process. CONSTITUTION: A plurality of bonding pads(1a) are arrayed in a line on a center portion of an upper face of a center pad type semiconductor chip(1). A lead frame is adhered at both sides of the bonding pads by an adhesive. The bonding pads of the semiconductor chip(1) are bonded by corresponding pins and corresponding metal wires(6). The pins are arrayed on both sides of the bonding pads. The first and the second floating interconnection bar(30a,30b) are arrayed on upper faces of the pins. The first and the second floating interconnection bar(30a,30b) have two bonding portions, respectively. A chip selection pad(2) of the bonding pads is basically bonded with a /CS pin(11). In addition, the chip selection pad(2) is electrically connected with NC pins(12,13,14) through the first and the second floating interconnection bar(30a,30b).
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