| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin having excellent developability, giving a cured material having excellent flexibility, soldering heat-resistance, thermal deterioration resistance and electroless gold plating resistance and especially useful for a solder resist and an interlayer insulation film. SOLUTION: The resin composition contains (A) an oligomer produced by reacting (a) a compound having biphenyl skeleton and phenol skeleton and containing phenolic hydroxy group with (b) a compound having one epoxy group and one (meth)acrylate group in the molecule, (B) a (meth)acrylate compound other than the compound used in the component A and optionally (C) an epoxy resin.
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