| 摘要 |
<p>The device includes a separating tool having at least two flexible elements (13,13') which are held in a support (14). The flexible elements have a width in the direction perpendicular to the planes of wafers, held together by forces of attraction, which is less than the greatest separation of the wafers. At least one of the wafers has an edge which is bevelled and the flexible elements comprise e.g. thin lamellae, or alternatively cylindrical elements. Several such separating elements may be provided, each including two of the separating lamellae, with a fan associated with the device.</p> |
