发明名称 COATING FILM FORMING APPARATUS
摘要 PURPOSE: To prevent the adhesion of particles to the surface of a substrate and to enhance the yield of a coating film formed on the surface of the substrate in an apparatus for supplying a chemical liquid to the substrate to form the liquid film of the chemical liquid. CONSTITUTION: A plate having a slit is provided between a nozzle part movable in a left and right direction and the substrate held by a substrate holding part movable in a forward and rearward direction and impact relaxing parts for suppressing the generation of mist from a coating liquid supplied to the outside of the slit are provided to the left and right ends of the slit and a pair of shutters capable of washing off the coating liquid received by the surface thereof are provided. A suction port is provided at the position in the vicinity of the slit over the range corresponding to the moving region of the nozzle part to suck mist generated at the time of scanning coating of the nozzle part. Further, a slit for dispersing a falling flow to the outside of the slit is provided to the plate.
申请公布号 KR20030023498(A) 申请公布日期 2003.03.19
申请号 KR20020053729 申请日期 2002.09.06
申请人 TOKYO ELECTRON LIMITED 发明人 KAWAFUCHI YOSHIYUKI;KITANO TAKAHIRO;KOGA NORIHISA;TAKEI TOSHICHIKA
分类号 G03F7/16;B05C5/00;B05C11/00;B05C11/10;H01L21/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/16
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