发明名称 |
Apparatus and method for endpoint control and plasma monitoring |
摘要 |
A substrate processing system having a bi-directional interface and concomitant communication protocol to allow a controller to communicate with an external endpoint system is disclosed. More specifically, the substrate processing system comprises a controller and an endpoint detection system that are coupled together via a RS-232 interface. A SECS compliant communication protocol is employed to effect communication between the controller and endpoint detection system to increase wafer processing information exchange and data exchange.
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申请公布号 |
US6535779(B1) |
申请公布日期 |
2003.03.18 |
申请号 |
US19980036217 |
申请日期 |
1998.03.06 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BIRANG MANUSH;KOLTE GREGORY L.;DOYLE TERRY LEE;JOHANSSON NILS;LUSCHER PAUL E.;POSLAVSKY LEONID |
分类号 |
G06F7/66;H01J37/32;H01L21/66;(IPC1-7):G06F7/66 |
主分类号 |
G06F7/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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