发明名称 |
ELECTRICALLY INSULATING THIN-FILM-FORMING RESIN COMPOSITION AND METHOD FOR FORMING THIN FILM THEREFROM |
摘要 |
<p>An electrically insulating thin-film-forming resin composition comprising (A) a hydrogen silsesquioxane resin, (B) a solvent-soluble polymer, and (C) a solvent; and a method for forming an electrically insulating thin film therefrom.</p> |
申请公布号 |
SG94746(A1) |
申请公布日期 |
2003.03.18 |
申请号 |
SG20010000433 |
申请日期 |
2001.01.30 |
申请人 |
DOW CORNING TORAY SILICONE COMPANY, LIMITED |
发明人 |
NAKAMURA, TAKASHI;SAWA, KIYOTAKA;KOBAYASHI, AKIHIKO;MINE, KATSUTOSHI |
分类号 |
C08L45/00;C08L65/00;C08L83/04;C08L83/05;C08L101/00;C09D5/25;C09D145/00;C09D183/04;C09D183/05;H01B3/46;H01L21/312;(IPC1-7):H01L21/31;C08L83/06;C08J5/18;H01L21/311;C09D183/06 |
主分类号 |
C08L45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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