发明名称 |
Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof |
摘要 |
A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality of bond wires electrically connects bond pads on the microelectronic die active surface to a plurality of corresponding traces within the recess.
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申请公布号 |
US6535388(B1) |
申请公布日期 |
2003.03.18 |
申请号 |
US20010971948 |
申请日期 |
2001.10.04 |
申请人 |
INTEL CORPORATION |
发明人 |
GARCIA JASON A. |
分类号 |
H01L23/24;H01L23/36;H01L23/427;H01L23/433;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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