发明名称 ACTIVE LIQUID COATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To realize an active liquid coating apparatus eliminating the waste of a noble metal because an electroless plating method capable of controlling film thickness is utilized and capable of coating the surface of an electronic component with a thin active film. SOLUTION: The active liquid coating apparatus 2 is constituted of a dispenser body 12 storing an active liquid 14, a coating part 21 for coating the surface of an electronic component 4 with the active liquid 14, the nozzle pipe 16 connected across the dispenser body 12 and the coating part 21, the penetration member 18 inserted in the nozzle pipe 16 to be connected to the coating part 21 at one end thereof and coming into contact with the active liquid 14 at the other end thereof to penetrate the active liquid 14 into the coating part 21, a means for bringing the coating part 21 into contact with the surface of the electronic component 4 and a means performing the relative motion of the coating part 21 and the electronic component 4 in a contact state to coat the desired region of the surface of the electronic component 4 with the active liquid 14. The active liquid is supplied to the surface of the electronic component by the coating part and natural force by utilizing the capillary phenomenon of the penetration member to form the active film and an electrode film is simply formed by electroless plating. Especially, an electrode is effectively formed to the inner surface of an oxygen sensor or the like.
申请公布号 JP2003080153(A) 申请公布日期 2003.03.18
申请号 JP20020114213 申请日期 2002.04.17
申请人 DAIKEN KAGAKU KOGYO KK;DENSO CORP 发明人 NISHI TAKESHI;TSUJIMOTO TOMOAKI;HARADA AKIO;KOBAYASHI KIYOMI;SATO MOTOAKI;FUJII NAMIJI
分类号 B05C7/06;B05C11/105;C23C18/18;C23C18/31;(IPC1-7):B05C7/06 主分类号 B05C7/06
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