发明名称 |
COOLING ADSORPTION ELEMENT |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve adsorption performance without making the whole shape large sized. SOLUTION: This cooling adsorption element is formed by alternately laminating a flat adsorption element (110) through which conditioning air to be dehumidified flows and a cooling element (120) through which cooling air flows to absorb the heat of adsorption generated in the adsorption element (110). The conditioning air in the adsorption element (110) and the cooling air in the cooling element (120) flow to cross each other. The thickness of the cooling element (120) and that of the adsorption element are made respectively uniform and the thickness of the cooling element (120) is formed to be thinner than that of the adsorption element. The adsorption element (110) is constituted so as to provid a corrugated board (113) between 2 sheets of planer boards (111, 112). The cooling element (120) is constituted so as to provide a reinforcing frame (123) between 2 sheets of planar boards (121, 122).</p> |
申请公布号 |
JP2003080021(A) |
申请公布日期 |
2003.03.18 |
申请号 |
JP20010278977 |
申请日期 |
2001.09.14 |
申请人 |
DAIKIN IND LTD |
发明人 |
SUEOKA YOSHIHISA;KI KANNAN;JINNO AKIRA |
分类号 |
B01D53/26;F24F3/12;F24F3/14;(IPC1-7):B01D53/26 |
主分类号 |
B01D53/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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