SEMICONDUCTOR SIDE BRAZE PACKAGING METHOD

摘要

PURPOSE: A semiconductor side braze packaging method is provided to perform simultaneously a flip chip bonding process and a sealing process by using a die attach film. CONSTITUTION: A plurality of semiconductor chips formed on a wafer are cut into individual units after the wafer is adhered to a frame by using a mount tape(S101,S102). A plurality of balls are bumped on a chip pad and the bumped chip is attached to a side braze package by using a die attach paste(S103,S104). The bumped balls are arranged on the chip pad. A flip chip bonding process and a sealing process are performed by using a die attach film(S105). The flip chip bonding process is to attach the chip pad to the die attach film. The sealing process is performed to protect a chip from the external environment. A cutting process is performed to individualize a support bar.