| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing device renewed and improved, applying compound vibration work by utilizing a simple device, which can more improve machining quality. SOLUTION: This dicing device, comprising a blade 22 rotated at a high speed to cut a workpiece and a spindle 30 rotating the blade 22 at a high speed, has a first vibration device 34 vibrating the spindle 30 in almost a perpendicular direction and a second vibration device 36 vibrating the spindle 30 in a direction with the blade 22 cutting the workpiece, to tender the dicing device characterized by making the blade 22 perform a compound motion to cut the workpiece by the first/second vibration devices. In such a constitution, by making compound vibration of the blade capable by a relatively simple structure, the workpiece can be cut smoothly and effectively. Moreover, by constituting the vibration device by a piezoelectric material, a vibration generating mechanism is more simplified. |
