Method and apparatus for reducing IC die mass and thickness while improving strength characteristics

摘要

A method for decreasing the mass and increasing the strength of an IC wafer assembly involves adding a polymer coating to the frontside of the wafer assembly to protect and strengthen the assembly, and removing silicon material from the backside of the wafer assembly, reducing the overall thickness of the assembly. The removal can be by backgrinding or by many other removal techniques, and in some cases is removed to a thickness less than that of the polymer coating.