发明名称 CUTTING APPARATUS AND CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cutting apparatus and a cutting method which can reduce working resistance and prolong a blade life. SOLUTION: The cutting apparatus is provided with a rotating shat 1, a blade 2, virtual individual regions 3, 4, etc., which are continuous on the blade circumference, rigid members 5F and 5R separated from the side face of the blade 2 and fixed to the shaft 1, and piezoelectric elements 6F, 6R, 7F, 7R, etc., fixed between the individual regions 3, 4, etc., and rigid members 5F and 5R. In cutting a substrate 8, voltages having an opposite phase to each other are applied to the piezoelectric elements 6F and 6R, respectively, pinching the individual region 3, and voltages having an opposite phase to voltages applied to the piezoelectric elements 6F and 6R are applied to the piezoelectric elements 7F and 7R, respectively, pinching the individual region 4. This constitution enables individual regions 3 and 4 adjacent to each other to alternately and repeatedly be spaced from and contacted with the substrate 8. Thus, when they are spaced, chips are eliminated, so that working resistance is reduced and the blade 2 is cooled.
申请公布号 JP2003080493(A) 申请公布日期 2003.03.18
申请号 JP20010271906 申请日期 2001.09.07
申请人 TOWA CORP 发明人 OSADA MICHIO;MATSUO MAKOTO
分类号 B26D7/08;B26D1/14;(IPC1-7):B26D7/08 主分类号 B26D7/08
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