SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a fabricating method thereof are provided to improve an electrical characteristic of the semiconductor package by forming metal patterns having electrodes on a main semiconductor chip. CONSTITUTION: A main semiconductor chip(100) is used as a lead frame or a substrate. A plurality of main chip pads are formed on the main semiconductor chip(100). A plurality of metal patterns are electrically connected with the main chip pads. A plurality of bumps(212) are formed on a plurality of sub chip pads. The bumps(212) corresponds to each electrode(110b1,110b2). One or more sub semiconductor chips(200) are adhered to the main semiconductor chip(100). A dam(302) is formed on the main semiconductor chip(100) in order to surround internal electrodes of the main semiconductor chip(100). A filling material(304) is buried into the inside of the dam(302). A plurality of solder balls(306) are adhered to each end of the electrode(110b1,110b2).