| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform a laser beam machining by homogenizing the distribution of light intensity when a work which is a semiconductor substrate on which a thin film is vapor deposited is heat treated via the thin film with a laser beam. SOLUTION: A laser beam 14 is made incident on a cylindrical face lens 11, condensed into a linear form with the cylindrical face lens 11 to be formed as a linearly condensed beam 15. Further, a lens holder 12 is rotated with a rotational power mechanism 13 and the linearly condensed beam 15 is rotated. Thus, the distribution of light intensity is homogenized by rotating the linearly condensed beam 15.</p> |
