| 摘要 |
A chip resistor reveals a crack for permitting easy detection of it in the inspection process, suffers from minimum variation of the resistance during calcination of a protection film, and is not prone to defects such as pinholes that do not come to the surface. This chip resistor is produced by forming a resistive layer on the surface of an insulating substrate, providing electrodes at both ends of the resistive layer, forming a resistive-layer protection film on the surface of the resistive layer, forming an intermediate protection film on the surface of the resistive-layer protection film, and forming a surface protection film on the surface of the intermediate protection film. In addition, in this chip resistor, the resistive-layer protection film, intermediate protection film, and surface protection film are all made of an identical material.
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