| 摘要 |
PURPOSE: A swing forming apparatus for forming a package lead is provided to easily mold the package lead without a scratch phenomenon even if a forming is deep, by making a forming punch rotate toward an anvil of a die in a lateral direction so that the package lead is bent and formed at the side surface. CONSTITUTION: A punch assemble block(300) is fixed in a punch plate(15) of a molding die for forming the lead of a semiconductor package(2) attached to a leadframe. A plurality of rotating punches(100) are coupled to the punch assemble block so as to rotate with respect to an axis, composed of two unit punches, respectively. An elastic member(120) is connected between each rotating punch and both unit punches to elastically support both unit punches so that both unit punches become wider. A guide roller(200) guides a stripper(16) to rotate in a direction that both unit punches of each rotating punch become narrower, coupled to the stripper and capable of rotating.
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