| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card with excellent surface smoothness without warps. SOLUTION: The IC card is provided with an IC substrate 1 composed of polyethylene terephtalate whose thickness is <=50 μm, an IC chip 2 and a capacitor whose thickness is <=200 μm loaded on one surface of the IC substrate, a spacer layer 4 arranged on one surface of the IC substrate and cover films 5 spread respectively on an upper surface of the spacer layer 4 and a lower surface of the substrate. |
